A few weeks ago, CPI had the privilege of attending Data Center World 2024 in Washington, D.C. as a Gold Sponsor, alongside our strategic partners, ZutaCore. We’re still reflecting on the valuable experience!
The gathering drew over 2,600 attendees to the Walter E. Washington Convention Center in D.C., representing a remarkable 34% growth from the previous year. Attendees came together with a palpable enthusiasm, eager to engage with like-minded peers and explore the latest data center technology.
Here are a few key event highlights:
Sustainability in Focus
Data center cooling emerged as a focal point of discussion at the conference, drawing considerable interest from attendees.
At our booth, visitors had the opportunity to witness firsthand the capabilities of CPI’s ZetaFrame® Cabinet System and ZutaCore’s HyperCool® technology. Through live demonstrations, we showcased how these innovations can work together to revolutionize data center operations, offering significant reductions in energy consumption.
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ZetaFrame® Cabinet System: ZetaFrame stands out as the ultimate integrated, all-in-one cabinet solution, delivering exceptional efficiency. Its welded frame and pre-installed airflow management accessories minimize energy consumption, ensuring your containment strategies are effective from day one.
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Revolutionary Cooling Technology: By integrating ZutaCore’s HyperCool® Solution into ZetaFrame, you can triple the processing capacity of highly dense computing environments. This is achieved while using less than 50% of the energy and occupying only half the space of conventional cooling systems.
- Ideal Integration for Sustainability: This integrated system is a significant step towards a zero-emission data industry, resonating with the sustainability goals of many attendees.
“Also referred to as cold plate or direct liquid cooling, direct on-chip cooling provides the most efficient heat transfer with the ability to cool CPU power up to 1000W.” - Sam Rodriguez, RCDD, Senior Product Manager, CPI
CPI Innovations Unveiled
We also had the opportunity to showcase our breadth of other innovations, including our latest:
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NEW: Elevate™ Adjustable Containment Solution: With a game changing telescoping design, this new solution enables you to effortlessly adjustment of containment to various heights, facilitating maintenance tasks and drastically reducing deployment times.
- eConnect® Power Distribution Units: We also showcased our intelligent eConnect PDU line, engineered to endure the high heat loads of any hot aisle environment. Available in over 180 standard configurations, including high-density models.
Insights from the Speaker Spotlight
A notable moment was the speaker session with our Senior Product Manager, Sam Rodriguez, RCDD, alongside Tony Medler from ZutaCore. Their presentation, "How Liquid Cooling is Changing the Landscape of Data Centers," was packed with attendees. The high level of interest in this topic was evident, reflecting its critical importance in the industry.
A few insights they shared:
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Direct on-chip liquid cooling is ideal for extremely high-power densities of 50kW or higher in HPC environments. It is the most effective liquid cooling because it is applied directly to processors to extract and disperse heat.
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Two-phase direct on-chip liquid cooling offers the advantage of using dielectric fluid with boiling and condensation processes that use no water in the system, protecting equipment from corrosion and other water-related threats.
- Unlike liquid immersion cooling, direct on-chip liquid cooling can be easily retrofitted into existing data center environments and allows servers to remain horizontally positioned within standard cabinets.
Engaging with the Data Center Community
We greatly enjoyed the discussions we had with everyone who stopped by our booth! It was great to connect with so many industry professionals who share our passion for a more efficient, sustainable future for data centers.
Looking Forward
Thank you to everyone who visited us and took part in this fantastic event. We look forward to seeing you next year in Washington, D.C. April 14-17, 2025!