Meet the Challenges of High-Density AI and HPC with Advanced Cooling Solutions

Today, AI is driving high-density racks in data centers along with other high-performance computing applications. With the exponential growth of data and the increasing demand for efficient and reliable data centers, we have continually innovated to address the challenges associated with heat dissipation and energy efficiency. 

Our commitment to research and development has led to the creation of advanced thermal management products that ensure optimal performance and longevity of critical IT equipment. By taking a holistic approach with hybrid cooling that involves a mixture of air-containment and liquid cooling, data centers can enhance performance and efficiency. 

Waterless direct-to-chip liquid cooling stands at the forefront of cooling technology by offering the highest performance and ensuring future-proofing in critical areas. It achieves precise temperature control at the processor level, effectively overcoming the thermal limitations associated with air and single-phase cooling methods. 
 

Maximize Performance and Efficiency with ZutaCore® Hypercool® Waterless Direct-to-Chip Technologies

Solutions like direct-to-chip liquid cooling efficiently handle extreme power densities in high-performance computing environment and are imperative for protecting data center equipment.

CPI’s innovative ZetaFrame® Cabinet System seamlessly integrates with ZutaCore’s waterless direct-to-chip liquid cooling, enabling higher computing power at half the total cost of ownership without modifying current real estate, power, or cooling infrastructure. ZutaCore Hypercool® enables data center operators to:

• Cool the hottest processors of 2800 watts and beyond
• Lower energy consumption by 82% compared to traditional air-based cooling systems
• Reduce the use of water and land
• Increase compute density by >100kW per rack
• Deliver upon net-zero goals
• Seamlessly integrate into CPI’s innovative ZetaFrame® Cabinet System
   

How the ZutaCore® Hypercool® Solution Works

ZutaCore's Hypercool uses a heat transfer fluid to remove the heat off the processors and away from the servers, making it 10x more efficient than single-phase liquid cooling. Each cold plate is connected in parallel and self-regulated. The closed-loop system controls pressure regardless of elevation and significantly reduces maintenance relative to open-loop systems, providing value to data centers of any size or cabinet density.

The Hypercool system features an air-based Heat Rejection Unit (HRU), which efficiently dissipates heat into the ambient room air, or a water-based HRU, which transfers heat to the facility water loop allowing 100% heat recovery in the data center. The HRU pumps heat transfer fluid to a manifold that distributes the fluid to cold plates mounted directly on the CPU's or GPU's, ensuring precise and effective heat removal at the source.

Seamless Integration with ZetaFrame® Cabinet System

Effectively protecting and powering technology starts with CPI’s ZetaFrame® Cabinet System that uses a modular, holistic approach to integrate cable management, thermal management, power management, environmental monitoring, and access control. These solutions work together as a single-vendor turnkey platform that supports increasing power densities while reducing costs and optimizing efficiency, availability, security, and scalability for evolving enterprise-owned, multi-tenant, cloud hyperscale, and edge data centers. 

Additionally, air containment and vertical exhaust ducts can further reduce heat to ensure the safekeeping of equipment. These solutions provide maximum flexibility for mechanical design and efficiency, even over close-coupled air-cooling strategies such as row-based or door-based systems, at a fraction of their costs. 

Benefits of integrating the ZutaCore solution into the ZetaFrame Cabinet System include:

• One complete, ready to deploy solution that has been installed and test in rack prior to shipping upon receipt
• PDU installation (optional)
• Reduced on-site packaging waste, labor, and footprint requirements in trucks for transport
• Reduced energy consumption and improved cooling efficiency, minimizing the reliance on traditional air conditioning systems, and lowering the overall carbon footprint of data centers