Scaling AI: The Next-Gen Infrastructure for Data-Hungry Workloads

When it comes to cooling AI workloads, especially in enterprises, it's crucial to find infrastructure solutions that don't require the substantial cost and disruption of building entirely new facilities. The goal is to optimize existing setups, minimize costs, and deliver the performance necessary for growing AI demands. 

The good news: cutting-edge solutions are now available to cost-effectively meet the needs of high-density AI environments while ensuring equipment remains reliable and energy efficient. 

Here are 5 key solutions you need to know: 

1. Liquid Cooling in High-Performance Data Centers 

Liquid cooling is revolutionizing how data centers manage the heat generated by AI infrastructure. Direct-to-chip (DTC) cooling offers unparalleled efficiency by directly targeting the hottest components—such as CPUs and GPUs—without requiring massive infrastructure changes. 

Direct-to-chip cooling is available in two main configurations: 

• Single-Phase Direct-to-Chip Cooling: Uses water-based coolants to manage moderate heat loads but poses a risk of leaks. 

• Two-Phase Direct-to-Chip Cooling: Utilizes waterless refrigerants that vaporize upon heat contact, absorbing 5–10 times more heat than single-phase cooling while eliminating leak risks. 

At Chatsworth Products, we’ve made deploying liquid cooling even easier with a turnkey solution. We can integrate ZutaCore® HyperCool® Two-Phase Direct-to-Chip Liquid Cooling directly into our ZetaFrame® Cabinet System.  

Together, they create a powerful and flexible hybrid cooling solution designed for high-density AI environments: 

• HyperCool® Waterless Liquid Cooling: Directly cools processors of 2800W and beyond, addressing up to 70% of the thermal load right at the chip. 

• ZetaFrame® Advanced Airflow Management: Manages the remaining 30% of heat with advanced features like air dams, chimneys, perforated door panels, and blanking plates, ensuring efficient cooling while eliminating hot air recirculation. 

Check out how sleek and effective this system is in our demo video: 

[Embed Sam’s Demo Video here] 

Learn more about how CPI can help you deploy this high-performance, sustainability-focused, ready-to-go solution in your data center. 

2. Power for AI's Insatiable Demands 

AI systems, especially those using GPUs, demand significant power—up to ten times more than CPUs. Data centers are evolving to handle power densities from 25kW to 120kW per cabinet. 

High-power configurations for CPI’s eConnect® PDUs are available up to 57.5kW, designed specifically for AI’s power-hungry needs. Key features include: 

• 30A Branch Circuit Protection: Handles GPU-heavy loads, allowing more devices without circuit overloads. 

• C20 Connectors: PU-based servers for AI applications usually have multiple power supplies that use 16A-rated C20 connectors, requiring a C19 outlet on the PDU.  eConnect PDUS have C19 outlets evenly distributed across circuits. 

• Industry-Leading Heat Ratings: Engineered to pair with liquid cooling for optimal performance. 

But it’s not just about raw power. eConnect PDUs come with intelligent monitoring and failover capabilities, allowing you to prevent power disruptions that could derail critical training cycles. With built-in environmental monitoring and integration with DCIM (Data Center Infrastructure Management), our PDUs provide real-time data on power, temperature, and humidity, ensuring your systems stay optimized. 

3. Taming Higher Cable Densities Within AI Clusters 

Real-time AI training requires very high-speed connections, (100-400 Gbps.) In larger AI setups, data often moves over multiple fibers for even faster communication or use breakout configurations where a single switch port connects to multiple GPUs.  

Even if you already have some decent cable management, AI setups can push your infrastructure to the limit – causing overcrowded racks and impacting airflow and cooling. It’s essential to have a system that can handle the complexity. 

These cable management systems are designed for AI environments: 

• CPI’s Motive® Cable Manager is ideal for fiber optic cables and high-density setups, offering a tool-less design and flexible central track system for easy access and organization.  

• For copper-heavy environments, CPI's Evolution® Cable Manager handles large bundles while maintaining airflow and bend radius. This is key for keeping hardware reliable and cool—especially important in AI, where cooling efficiency directly impacts performance.  

4. An Integrated Scalable Cabinet Solution for AI Workloads 

As AI workloads become more complex, a flexible, integrated infrastructure is crucial. The ZetaFrame® Cabinet System from Chatsworth Products offers the perfect balance of simplicity and adaptability, making it ideal for anyone looking to scale their AI setup quickly and efficiently. 

Benefits of the integrated ZetaFrame® Cabinet System include: 

• Choose from pre-configured options OR fully customize your cabinet—without compromising on speed.   

• The ability to pre-install intelligent PDUs for real-time insights into power, cooling, and equipment performance.  

• Integrated cable management, grounding and bonding, and airflow management means it’s ready for today’s demands and tomorrow’s growth.  

• Order everything under a single part number for simplicity. 

5. Achieving Full Containment: 

With higher rack power densities in GenAI, many data centers with partial containment are struggling to maintain proper equipment temperatures, leading to costly over-provisioning of cooling. Rising energy costs and new regulations make this approach unsustainable. While some operators consider liquid cooling, achieving full containment can be a more cost-effective alternative for AI systems. 

The key is eliminating hot and cold air mixing. Data center operators can do this by following these best practices: 

• Leverage Build To Spec (BTS) aisle containment solutions that accommodate varying site conditions and cabinet sizes to completely separate hot and cold air. 
• Use sealed doors (automatic if possible) instead of curtains.  
• Ensure strong seals between ceiling panels and ducts. 
• Seal floor openings with brush or gasketed grommets. 
• Use blanking panels to close unused rack spaces and bottom panels to block airflow under cabinets. 
• Optimize cabinet airflow with air dam kits to seal the space between equipment mounting rails and the top, bottom, and side panels of cabinets. 

Computational Fluid Dynamics (CFD) modeling software is a valuable tool for this purpose. It can pinpoint where conditioned air is wasted, identify mismatches between airflow demand and supply, and model the potential impact of implementing solutions.  

Ready to future-proof your AI data center? Our experts are here to help. 

• Get a Free CFD Modeling Consultation: Take the first step toward enhancing your data center's efficiency. Contact us. 
• Get a Personalized Quote: Discover how we can help design an AI-ready, high-performing, and future-proof data center. Request a quote. 
• Talk to Our Experts: Have questions? Get in touch today.