ICT Primary Bonding Busbar (PBB) provides a central bond attachment point for ICT bonding backbones, equipment and the building’s ground electrode system.
Hole patterns on Busbars accommodate two-hole lugs per the recommendation of ANSI/BICSI N3-20 and ANSI/TIA-607 standards. Insulators electrically isolate Busbars from the wall or other mounting surfaces, thereby controlling the current path.
Key Features and Benefits
Mounting brackets are manufactured from high-quality 300 series stainless steel with 3/8” (9.53 mm) diameter mounting holes spaced 5.75” (146.1 mm) apart
Busbars mount on the wall, floor or ceiling
Ships preassembled
Sold individually
UL Listed, File E236184, Category KDER (US), KDER7 (Canada)
